Laminating Machine for Thin-Film Solar Cell Substrate Assembly and Package

Laminating Machine for Thin-Film Solar Cell Substrate Assembly and Package

SPECIFICATIONS

The equipment is used in the substrate and backplane packaging line, including substrate insulation adhesive application, convergence strip application, diversion strip application, sealant application, EVA four-sided cutting and punching and cover backplane, the whole line output efficiency ≤ 50S, high precision and efficiency.

Equipment composition and introduction

After the machine automatically pulls the EVA film and cuts it, it moves to the cutting platform, the vacuum suction plate presses the EVA film, and cuts the EVA film on the outer ring of the vacuum suction plate (the cutter and the rotating device are equipped with safety protection hood), while completing the EVA material punching.

After cutting, the vacuum suction cup automatically moves to the top of the battery plate, and accurately covers the EVA film on the center of the substrate. After the film transfer mechanism return, the glass back sheet automatic turning machine (equipped with a safety net) covers the pre-prepared glass back sheet on the battery plate that has been covered with the EVA film. The laid EVA is wrinkle-free and stain-free, and cutting waste is collected automatically. Backboard after lamination, no oil, no dust and no chipping

Parameter

a. Appearance size: 

   5520*2570*1800（for 600*1200 substrate）；

   8255*1800*1700（for 1000*2000 substrate）；

b. Running speed: 50~400mm/s adjustable (Touch screen digitally adjustable)

c.Substrate positioning tolerance: ±0.5mm

d. EVA cutting accuracy: ±0.5mm,

   EVA film punching position accuracy: ±0.5mm

   EVA film punching dimensional accuracy: ±1mm

e.Matching gap between EVA film and sealing tape: -0.5mm~1.5mm

f.Backplane lamination deviation: ±1mm

g.EVA cutting size around ±5mm adjustable (with precise adjustment device)

h. The life of EVA punching knife ＞300000times

i.EVA refill time ＜4s

j.Overall efficiency ≤52s

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